EV Group Launches EVG620HBL Mask Alignment System for HB-LED Market
Feb 23, 2011 EV Group (EVG), a supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, announced the latest addition to its portfolio of products created to optimize the manufacture of high-brightness light-emitting diodes (HB-LEDs), compound semiconductors and power electronics. The new EVG620HBL fully automated mask alignment system builds on EVG's field-proven mask aligner platform, adding a high-intensity ultraviolet (UV) light source and five cassette stations to enable continuous fabrication of devices. As a result, the EVG620HBL delivers unparalleled throughput of up to 165 six-inch wafers per hour (up to 220 wafers per hour in first print mode) with the industry's highest alignment accuracy and yield.
Another key feature of the EVG620HBL is the availability of special recipe-controlled microscopes whose illumination spectrum is optimized to ensure the best pattern contrast with various wafer and layer materials, including such advanced substrate materials as sapphire, silicon carbide (SiC), aluminum nitride (AlN), metal and ceramic.
The EVG620HBL is available for purchase immediately.
Author: BIO T&T
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