Foiled aluminum for PCB production from Polytronics Technology Corporation

Aug 22, 2011 According to compnay's press release, NEON-EK introduced foiled aluminum for PCB production from Polytronics Technology Corporation. The main characteristic of this material is high thermal conductivity. It is 20 times higher than traditional epoxy system that allows applying it in systems with intensive heating. While PCB based on Polytronics foiled aluminum is affected by high temperature, it saves its form and has no bending.

Today there are only few companies produce material for metal-base PCB manufacturing. The advantages of Polytronics foiled aluminum is in dry method of insulator production (unlike other manufacturers using wet process), that allows to provide high precision of insulator thickness 80-200 micron. It also enables even thermal conductivity along axes, good coupling of the layers, high flexibility and mechanical strength.

NEON-EK  reports that their stock has always available foiled aluminum with thermal conductivity 2, 4, 8W/mK with the following specifications:

Aluminum base thickness – 1.5 mm
Insulation (P/P) thickness - 100 micron
Copper thickness – 35 micron
Insulator conductivity -2, 4, 8 W/mK
Aluminum base conductivity (5052) - 140W/mK
Breakdown voltage 4 KV
Glass-transition temperature (Tg) -140

For more information please refer to the company's website:

Author:  Alice Jones

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