NexLogic Technologies Will Present Its Latest Developments at PCB West 2011
Sep 13, 2011 According to official press release NexLogic Technologies Inc. has developed new method for efficient fabrication and assembly of most popular miniature LED packages utilized by smartphones and PC tablets. All the associated problems and their solutions will be discussed in detail at the PCB design, assembly and fabrication workshop at PCB West 2011 on September 27, 2011 at Santa Clara Convention Center.
NexLogic President, Zulki Khan, will be the key presenter for the company at the workshop. Among topics of special attention will be programming optimal thermal path when heat is generated at the LED junction and then transferred to ambient directly or by external means. That requires generation of the thermal model. Model generation and application to generate the best possible solution will be discussed. In addition a significant consideration will be given to the selection of right materials for the interfaces, heat sinks and heat transporters.
For more information please refer to press release via PRWeb: www.prweb.com/releases/prwebPCB-design-assembly/LED-packages/prweb8778804.htm
Author: Alice Jones
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