CeramCool heatsinks with metallization eliminate need for PCB
Sep 2, 2009 The possibility of metallization makes the whole surface of the heat-sink useable as a circuit carrier which can be firmly packed with LEDs and drivers on customized circuit layouts – while providing reliable electrical insulation. The process can be simplified by bonding the chip directly onto the specially
designed CeramCool metallic surface.
Tungsten, tungsten-nickel and tungsten nickel-gold metallizations are standard. Other forms are also possible such as silver, silver-palladium or gold. Direct copper bonding for power electronic applications is not a problem with CeramCool. Even three-dimensional application of circuit structures is possible.
The optimized geometry of the CeramCool Cube family allows operation of a 4 W LED at a maximum temperature of 60 °C. It reduces the temperature at the hotspot by 6 °C, resulting in a significant reduction of stress on critical components. The thermal resistance of a ceramic assembly with CeramCool Rubalit® is at least 13 % better than aluminum for an identical shape – and more than 31 % better with a ceramic assembly with CeramCool Alunit. The new heat-sink design is square in shape (38 mm x 38 mm x 24 mm) and comprises longer, thinner fins with a larger spacing. The geometry is available with layouts/circuits for typical LEDs.
CeramCool with metallization e.g. for 1 x 4 W Acriche LED,
3 x 1 W Rebel LED and 6 x 1 W Rebel LED.
Author: Yaroslav Oleksenko
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