CeramCool heatsinks with metallization eliminate need for PCB

Sep 2, 2009 The possibility of metallization makes the whole surface of the heat-sink useable as a circuit carrier which can be firmly packed with LEDs and drivers on customized circuit layouts – while providing reliable electrical insulation. The process can be simplified by bonding the chip directly onto the specially
designed CeramCool metallic surface.

Tungsten, tungsten-nickel and tungsten nickel-gold metallizations are standard. Other forms are also possible such as silver, silver-palladium or gold. Direct copper bonding for power electronic applications is not a problem with CeramCool. Even three-dimensional application of circuit structures is possible.

CeramCool Metalization

The optimized geometry of the CeramCool Cube family allows operation of a 4 W LED at a maximum temperature of 60 °C. It reduces the temperature at the hotspot by 6 °C, resulting in a significant reduction of stress on critical components. The thermal resistance of a ceramic assembly with CeramCool Rubalit® is at least 13 % better than aluminum for an identical shape – and more than 31 % better with a ceramic assembly with CeramCool Alunit. The new heat-sink design is square in shape (38 mm x 38 mm x 24 mm) and comprises longer, thinner fins with a larger spacing. The geometry is available with layouts/circuits for typical LEDs.

Ceram Cool
CeramCool with metallization e.g. for 1 x 4 W Acriche LED,
3 x 1 W Rebel LED and 6 x 1 W Rebel LED.

Author:  Yaroslav Oleksenko

Back to the list

Reviews forum #FORUM# is not exist

Submit Product Review

Download Review Form

LED Jobs Banner LED Directory Banner

Recent News

12/06/2011 Pleasanton Library Cuts Energy Use By 46% With Adura Technologies Wireless Lighting Controls

12/06/2011 Forepi Selects AIXTRON´s New 19x4-inch CRIUS II-XL

12/06/2011 Future Lighting Solutions Wins 2011 Best LED Service Provider Award

12/06/2011 Leica Microsystems Presented Its Latest Range of Innovative LED Illumination Modules for Microscopy

12/06/2011 Xicato Introduced 3000lm and 4000lm XLM LED Modules

12/06/2011 A.C. Lighting Inc Appointed LedGo North American Distributor

12/05/2011 Electronics Weekly Publishes Interview with Adrian Rawlinson, Marl International

12/05/2011 New ENCELIUM White Paper Examines How Addressable Dimming Controls Help Buildings Earn LEED Points

12/05/2011 i-Pix Satellite Mk II LED Fixtures Launched in September 2011 Gain Immediate Popularity

12/05/2011 Lumenpulse Unveiled Corporate Headquarters with "Evolution of Light" Event in Montreal, Canada

12/05/2011 Anolis Deliveres LED Architectural Lighting Solutions in South Africa

12/02/2011 Lighting Science Group's New 60-Watt Equivalent LED World Bulb Receives Consumer Electronics Show Best of Innovations Award

12/02/2011 Jim H. McClung Lighting Research Foundation Announced Funding of Research Projects

12/02/2011 Magnalight.com Introduced New Explosion Proof Handheld LED

12/02/2011 SDG&E LED Holiday Light Exchange Brings Energy Savings to Balboa Park, Chula Vista and Escondido

12/01/2011 ZENARO Presents New Louver Luminaires with T5 LED Tubes

12/01/2011 Arima Changzhi Ramps Up HB LED Capacity with AIXTRON G4 MOCVD Systems

12/01/2011 CSA's State-of-the-Art LED Lighting Laboratory Opened in Atlanta

11/30/2011 Chroma-Q™ Launched Three New LED Luminaires

11/30/2011 Cree Introduced the New LMH2 LED Module Family