Next Generation HBLED Batch Production Tools
Oct 19, 2010 Oxford Instruments Plasma Technology launches the PlasmaPro™ NGP®1000 HBLED range of plasma etch and deposition tools, which satisfies to the need of throughput with batch sizes from 61 x 2" wafers up to 7 x 6" wafers, coupled with high-quality device performance and yield for HB-LED manufacturing.
The NGP1000 range has been designed to enhance throughput, maximise uptime and reduce cost of ownership through reliable hardware and ease of service. The NGP1000 platform has been optimised for batch production, with a vacuum load lock as standard. Open load and 4-sided cluster options are available.
The PlasmaPro NGP1000 PECVD system is designed for the deposition of SiO2 and SiNx layers, and incorporates a large area electrode and optimised showerhead design, allowing up to 61 x 2”, 15 x 4” or 7 x 6” wafers in a single load. The PlasmaPro NGP1000 etch system, designed for GaN, AlGaInP and Sapphire etch, offers batch sizes up to 55 x 2”, 13 x 4” or 5 x 6”, yielding market leading volumes of wafers/month.
Author: BIO T&T
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